eDrift Electric
Power Electronics · DC-DC Converter · SiC Retrofit

Retrofitting a 22 kW Bidirectional DC-DC Converter from IGBT to SiC: +3.8% Efficiency and 50°C Lower Junction Temperature

How Edrift Electric redesigned the power stage of an existing 22 kW bidirectional DC-DC converter — replacing IGBT switches with SiC MOSFETs — delivering measurable efficiency gains.

Industry
EV Charging Infrastructure
Type
Bidirectional DC-DC Converter
Technology
Silicon Carbide (SiC) — IGBT Retrofit
Status
Production
96.1%
Peak System Efficiency
+3.8%
Efficiency Improvement
50°C
Junction Temp Drop
Switching Frequency

01. Client Overview

Strategic Partnership & Objectives

A Bangalore-based EV charging infrastructure company was deploying bidirectional DC-DC converters as the core power conversion stage in their V2G-capable charging stations. Their existing design was performing at 92.3% peak efficiency, creating energy loss and thermal issues.

SegmentEV Charging Infrastructure Provider
ApplicationV2G Bidirectional Charging Station
Power Level22 kW continuous bidirectional
ChallengeEfficiency + thermal + size reduction

02. Engineering Challenge

Overcoming Technical Limitations

The client's bidirectional DC-DC converter was built around a Dual Active Bridge (DAB) topology using 1200V IGBT modules. The design was failing on efficiency, thermal management cost, and switching frequency limitations.

Critical Bottlenecks Identified:

1.69 kW continuous heat generation per unit wasting network power
Forced-air cooling system adding 2.1 kg and increasing failure rates
Switching frequency limited to 20 kHz by IGBT losses
Requirement: Improve efficiency above 95.5% and eliminate active cooling

03. Technical Constraints

Hard Design Constraints

Electrical & Mechanical

TopologyDual Active Bridge (DAB) — fixed
Power Rating22 kW continuous | 25 kW peak
Switching FrequencyMust exceed 40 kHz
PCB footprint340mm × 220mm — fixed
CoolingPassive target — remove active system

04. Design Approach

Multi-Stage Topology Optimization

Edrift's engineering scope was focused entirely on the power stage — devices, gate drivers, magnetics, and thermal path, while maintaining the DAB topology and control firmware.

SiC Device Sizing

Four SiC devices placed in parallel on each switch position (16 total) to achieve current rating while maintaining junction temperatures within 90°C in passive cooling.

Gate Driver Redesign

Fundamental shift from ±15V (IGBT) to +18V/-4V (SiC). Dead-time reduced 6× from 3.2μs to 480ns, improving phase-shift control resolution.

Transformer Re-Optimization

Redesigned with EE55 N87 ferrite core (34% smaller). Interleaved winding structure reduced AC copper loss by 42%. Leakage inductance precisely controlled at 18μH.

Thermal Redesign

SiC dissipated 62% less heat. Custom aluminium cold-plate replaced fan-cooled heatsink, achieving target temperatures via natural convection.

05. Semiconductor Selection

Power Switch Matrix

The IGBT → SiC selection required analysis at 1200V, where SiC delivers very large performance advantages.

Parameter1200V IGBT1200V SiC (A)1200V SiC (B)
Rdson / Vce(sat)2.0V sat40 mΩ16 mΩ
Switching loss3.8 mJ0.6 mJ0.38 mJ
Body diode Qrr12 μC00
Max Tj150°C175°C175°C
Selection Rationale:
  • Wolfspeed C3M0016120K enabled lowest conduction loss (4 mΩ effective).
  • 10× lower switching loss than IGBT.
  • Zero body diode reverse recovery critical for DAB operation.
  • Kelvin source package enabled lower gate drive inductance.
Final Device BOM:
All Bridge Switches
Wolfspeed C3M0016120K — 1200V, 45A, SiC MOSFET

06. Efficiency Performance

Measured System Efficiency

Efficiency comparison across power levels for the charge direction.

Efficiency vs Load Sweep
Load %BaselineEdrift Design
5 kW88.6%93.1%
10 kW91.4%95.2%
22 kW92.3%96.1%
Impact Summary
Network-level impact: 34 kW continuous power saving
Annual energy saving: 297,840 kWh
Payback on SiC premium: 11 months

07. Thermal Analysis

Heat Management & Junction Temperatures

Heat generation reduced by 68% at full load, enabling fan removal.

Strategy

Custom aluminium cold-plate matched to existing PCB pattern. Natural convection from enclosure surface.

Thermal Path
Tj → Tc → TIM → Cold Plate → Enclosure → Ambient
Junction Temps (Full Load)60°C Ambient
DeviceBaselineDesignDelta
Primary MOSFETs127°C77°C−50°C
Secondary MOSFETs119°C72°C−47°C
Transformer winding98°C74°C−24°C

Thermal Success Criteria Met

Fans eliminated, saving 45W auxiliary power and removing highest failure rate component.

08. Power Density & Form Factor

Volumetric Comparison

Weight reduction and reliability improvement through component integration and cooling elimination.

Cooling TypePassive
BASELINE: Forced airIMPROVEMENT: NaN%
Heatsink Weight0.68 kg
BASELINE: 2.1 kgIMPROVEMENT: 68%
Noise LevelSilent
BASELINE: 62 dB(A)IMPROVEMENT: NaN%
Volume Recovery Vectors
  • 1
    Reduced core volume: 34% smaller
  • 2
    Eliminated fans and associated auxiliary power stage
  • 3
    Lower gate drive dissipation
  • 4
    Integrated resonant inductance

Mechanical Outcome:

3-year saving per unit: ₹64,420. Saving across 40 stations: ₹25.8 L.

09. Testing & Validation

Rigorous Automotive-Grade Verification

Electrical, thermal, and firmware compatibility testing confirmed successful retrofit.

Electrical & Compatibility
Bidirectional power flow
PASS
Firmware compatibility
PASS
CAN communication
PASS
Isolation 4000V AC
PASS

10. Deployment Outcome

Field Results & Scaling

40 stations upgraded with SiC power stages, showing 0 failures over 8 months.

Units Upgraded
40 stations
Field Failures
0
Avg. Efficiency
95.6% (field)

Ready to Optimize Your Power System?

Our engineering team works with Tier-1 OEMs to deliver automotive-grade SiC and GaN solutions that scale.

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