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technical guides 10 min2025-10-05

GaN vs SiC: Which Semiconductor for Which EV Application?

EE

eDrift Engineering

Power Electronics R&D

Material Properties Comparison

PropertySiliconSiCGaN
Bandgap (eV)1.123.263.44
Breakdown field (MV/cm)0.33.03.3
Electron mobility (cm²/V·s)14009502000
Thermal conductivity (W/cm·K)1.53.71.3

Key Insight: GaN has higher electron mobility (lower Rdson), but SiC has much higher thermal conductivity. This makes SiC better for high-power density and high-temperature applications.

Application Selection Framework

By Voltage

  • < 200V: GaN wins clearly.
  • 200V – 400V: GaN competitive, but SiC thermal advantage starts showing.
  • 400V – 1200V: SiC wins (GaN limited to 650V in mainstream).
  • By Power Level

  • < 1 kW: GaN preferred (low dissipation).
  • 1 kW – 7 kW: Both viable. GaN for PFC, SiC for DC-DC.
  • > 22 kW: SiC dominates due to thermal requirements and paralleling maturity.
  • Decision Table: EV Charging Applications

    ApplicationGaNSiC
    Totem-pole PFCPreferredViable
    3.3 kW OBC DC-DCViablePreferred
    22 kW BidirectionalNot RecommendedPreferred
    60 kW DC Fast ChargerNot RecommendedPreferred
    Wireless Charging PadPreferredNot Recommended

    The Edrift Approach: Hybrid Design

    We extract optimal performance by using GaN for the totem-pole PFC stage (high frequency, zero recovery) and SiC for the isolated DC-DC stage (bidirectional body diode, thermal advantage). This achieves >96% system efficiency.

    Need Advanced Specifications?

    Download the **eDrift OEM Buyer’s Guide** for detailed power electronics benchmarking and SiC/GaN integration strategies.

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