GaN vs SiC: Which Semiconductor for Which EV Application?
eDrift Engineering
Power Electronics R&D
Material Properties Comparison
| Property | Silicon | SiC | GaN |
|---|---|---|---|
| Bandgap (eV) | 1.12 | 3.26 | 3.44 |
| Breakdown field (MV/cm) | 0.3 | 3.0 | 3.3 |
| Electron mobility (cm²/V·s) | 1400 | 950 | 2000 |
| Thermal conductivity (W/cm·K) | 1.5 | 3.7 | 1.3 |
Key Insight: GaN has higher electron mobility (lower Rdson), but SiC has much higher thermal conductivity. This makes SiC better for high-power density and high-temperature applications.
Application Selection Framework
By Voltage
By Power Level
Decision Table: EV Charging Applications
| Application | GaN | SiC |
|---|---|---|
| Totem-pole PFC | Preferred | Viable |
| 3.3 kW OBC DC-DC | Viable | Preferred |
| 22 kW Bidirectional | Not Recommended | Preferred |
| 60 kW DC Fast Charger | Not Recommended | Preferred |
| Wireless Charging Pad | Preferred | Not Recommended |
The Edrift Approach: Hybrid Design
We extract optimal performance by using GaN for the totem-pole PFC stage (high frequency, zero recovery) and SiC for the isolated DC-DC stage (bidirectional body diode, thermal advantage). This achieves >96% system efficiency.
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